Optoelectronic housings and methods of assembling optoelectronic packages

ABSTRACT

Optoelectronic housings and methods of assembling optoelectronic packages are disclosed. An example of such an optoelectronic package includes an optoelectronic module having a substrate, a first optical fiber extending in a first direction from the substrate, and a second optical fiber extending from the substrate in a second direction opposite the first direction. It also includes a body defining a chamber dimensioned to receive the optoelectronic module, and an optical fiber feedthrough fixed to a first side of the body for receiving the first optical fiber. A bore is defined in a second side of the body opposite the first side of the body. The bore is positioned to receive the second optical fiber. A second optical fiber feedthrough is threaded onto the second optical fiber and slid into the bore after the second optical fiber is positioned in the bore. The second feedthrough is then secured to the body.

FIELD OF THE DISCLOSURE

This disclosure relates generally to optoelectronics and, moreparticularly, to optoelectronic housings and methods of assemblingoptoelectronic packages.

BACKGROUND

It is known to hermetically seal an optoelectronic module within a metalhousing to create an optoelectronic package which may be used, forexample, in an optical communication system. Typically, anoptoelectronic module includes a semiconductor laser diode mounted on asubstrate, one or more lenses to focus the laser light generated by thelaser, and one or more optical fibers to carry the focused laser lightout of the package. The optical fiber(s) typically include a glass corefor carrying the light which is protected by a coating of polymer. Thepolymer coating is stripped and the core or a section of the core ismetallized (i.e., surrounded by solderable metal) to facilitatesoldering the fiber in a desired location.

An example prior art housing 10 for an optoelectronic module is shown inFIG. 1. The housing 10 includes a body or can 12 which defines a chamberthat is dimensioned to receive an optoelectronic module 14. In theexample of FIG. 1, the housing 10 is adapted to receive a module havingone optical fiber. To this end, the body 12 of the housing includes afixed feedthrough 18. The feedthrough 18 is brazed to the metal can 12such that it cannot be removed. In other words, the body 12 isconstructed with the fixed feedthrough, 18 before the optoelectronicmodule 14 is placed in the chamber. An optoelectronic module 14assembled outside the housing 10 is then inserted into the housing 10 bythreading the optical fibers mounted to the module 14 through the fixedfeedthrough 18 from within the chamber.

Another example prior art optoelectronic package 22 is shown in FIG. 2.The prior art package 22 of FIG. 2 includes a housing 24 which, like thehousing 10 of FIG. 1 is adapted for use with an optoelectronic module25. However, the module 22 is designed for use with two optical fibers26, 28 which extend in opposite directions from one another.

To secure the fibers 26, 28 to the optoelectronic module 25, the outerpolymer coating of a section of each of the fibers 26, 28 is strippedaway and metallization is applied in the required section of the fiber.The metallized layer is then soldered to secure the fiber 26, 28 to thedesired location of the optoelectronic module 25. While the metallizedlayer renders an optical fiber 26, 28 solderable, a metallized area ofan optical fiber 26, 28 has reduced flexibility relative to thenon-metallized, polymer coated portions of the fiber. As a result, themetallized areas of the optical fibers 26,28 are more breakable than thenon-metallized, polymer coated areas.

Because it is necessary to solder the optical fibers 26, 28 to oradjacent the optoelectronic module 25, the areas of the fibers 26, 28adjacent the module 25 must be metallized. Since the area of the fiberthat is stripped and metallized is much more fragile and susceptible tobreakage under bend stresses, the housing 24 of FIG. 2 is extended. As aresult, the assembled module 25 can be placed into the housing 24 andthe fibers 26, 28 can be threaded through respective ones of first andsecond fixed feedthroughs 30, 32 (which are brazed on opposite ends ofthe housing 24) without severely bending the fibers. For example, fiber26 may be threaded into its feedthrough 32. The module 25 may then beplaced at the far end of the enclosure adjacent the enclosure wall.Then, the fiber 28 can be threaded into its feedthrough 30. Once thefibers 26, 28 are threaded, the module 25 must be centered within theenclosure to position the metallizations within their respectivefeedthroughs 30, 32 for final fiber sealing. The extended housing 24ensures that sufficient distance exists between the ends of the fibers26, 28 secured to the module 25 and the respective feedthroughs 30, 32to eliminate the need to sharply bend the fibers 26, 28 when threadingthem through the feedthroughs 30, 32 thereby minimizing the bending ofthe fibers 26, 28 during assembly and, thus, reducing the risk ofbreakage.

As mentioned above, in addition to its extended length, the prior arthousing 24 includes two fixed feedthroughs 30, 32. As shown in FIG. 2,each of the feedthroughs 30, 32 is a cylindrical structure having an endbrazed to the body of the housing 24, and a central channel forreceiving an optical fiber 26, 28. Each feedthrough 30, 32 also includesa solder holder 36 for receiving solder to hermetically seal the fiberto the housing 24. Each feedthrough 30, 32 also includes an epoxy holder38 to receive epoxy to secure a furcation tube within the end of thefeedthrough. The furcation tubes serve to protect their correspondingfibers 26, 28 against damage.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic illustration of a prior art housing for anoptoelectronic module.

FIG. 2 is a schematic illustration of another prior art optoelectronicmodule.

FIG. 3 is a perspective view of an example housing constructed inaccordance with the teachings of the invention.

FIG. 4 is an exploded view of the housing of FIG. 3.

FIG. 5 is a side phantom view of the body of the housing of FIG. 3 shownwith one optical fiber of the optoelectronic module inserted into afixed feedthrough.

FIG. 6 is a cross-sectional view similar to FIG. 5, but showing the pillinserted into the body.

FIG. 7 is a view similar to FIG. 6, but showing the second optical fiberinserted through the bore of the body.

FIG. 8 is a view similar to FIG. 7, but showing the second feedthroughbeing threaded onto the second optical fiber.

FIG. 9 is a view similar to FIG. 8, but showing the second feedthroughfully inserted into the body of the housing.

FIG. 10 is a view similar to FIG. 9, but showing the pill beingrelocated within the chamber of the body.

FIG. 11 is a view similar to FIG. 10, but showing solder preforms placedin the solder holders of the first and second feedthroughs.

FIG. 12 is a top view of the example optoelectronic package of FIGS.5-12 shown with the cover removed.

DETAILED DESCRIPTION

FIG. 3 is a perspective view of an example housing 40 for anoptoelectronic module 42 having a substrate 41 and two optical fibers43, 45 extending in opposite directions from the substrate 41 (see, forexample, FIG. 5). In the illustrated example, the optical fibers 43, 45each include an outer polymer coating 47 which may be stripped away toexpose one or more sections of the fiber core. The exposed coressection(s) may then be metallized to form one or more metallizedsections 49 to facilitate soldering as is conventional.

For the purpose of receiving and protecting the optoelectronic module42, the housing 40 is provided with a body or can 44. The body 44 may bea metal rectangular structure that is plated for soldering as shown inFIG. 3. The body 44 defines a chamber 46 which is dimensioned to receivethe optoelectronic module 42. The body 44 and the chamber 46 shown inFIG. 3 are longer than the body and chamber of the prior art housingshown in FIG. 1, and shorter than the body 24 and chamber of the housingshown in FIG. 2. In the example illustrated in FIGS. 3-12, the combinedlength of the substrate 41, and the two optical fibers 43, 45 exceedsthe distance between the opposite ends of the body 44 through which thefibers 43, 45 must pass.

In order to provide a channel for threading one of the optical fibers 43through the body 44, one end of the body 44 is provided with a fixedoptical fiber feedthrough 50. The fixed feedthrough 50 shown in FIGS. 3and 4 is of conventional design. Thus, the fixed feedthrough 50 in thisexample is a generally cylindrical structure defining a centrallylocated channel. The channel is dimensioned to threadingly receive oneof the optical fibers (e.g., fiber 43) as shown in FIG. 5. Thus, thechannel has an open internal end 52 in communication with the chamber46, and an open external end 54 from which the threaded optical fiberemerges.

As is conventional, the fixed feedthrough 50 includes a solder holder58. The solder holder 58 is an aperture formed in an upper surface ofthe feedthrough 50 as shown in FIGS. 3 and 5. The aperture 58 is incommunication with the channel defined through the center of thefeedthrough 50. Thus, after the fiber 43 is threaded through thefeedthrough as shown in FIG. 10, a solder preform 59 may be insertedinto the holder 58 as shown in FIG. 11. When the preform 59 issufficiently heated with a soldering iron or the like, the solder meltsand flows into the channel of the feedthrough 50 to thereby form ahermetic seal around the fiber 43

In the illustrated example, the fixed feedthrough 50 may also include asealant holder 57 such as sealant holder 38 shown in FIG. 2. The sealantholder 57 is substantially identical to the solder holder 58, but islocated further from the body 44 and functions to receive epoxy or someother sealant. As mentioned above, the sealant functions to secure afurcation tube within the channel of the feedthrough 50 to furtherprotect the fiber 43 against damage and provide an additional layer ofsealant to protect the optoelectronic module against environmentalinfluences.

The fixed feedthrough 50 is permanently secured to the body 44 beforethe optoelectronic module 42 is positioned within the chamber 46 andbefore the fiber 43 is threaded into the feedthrough 50. The feedthrough50 can be fixed to the body 44 through any of many well known techniquessuch as brazing. As shown in FIG. 5, in the illustrated example thefirst fixed feethrough 50 does not extend into the chamber 46 of thebody 44.

Also, although for simplicity of illustration they are not shown in thedrawings, the housing 40 includes a plurality of electrical contacts(see, for example, the electrical contacts shown in FIG. 1) that enablea control circuit external to the housing 40 to control theoptoelectronic module 42. The electrical contacts and the manner inwhich they pass through the housing 44 and connect to the module 42 areentirely conventional and, thus, will not be further discussed herein.

In order to facilitate threading the second fiber 45 of theoptoelectronic module 42 through the body 44 of the housing 40 after thefirst fiber 43 is threaded through the fixed feedthrough 50 and themodule 42 is located within the chamber 46, the body 44 defines a largediameter bore 60. The bore 60 is positioned in a side of the body 44opposite the side where the fixed feedthrough is secured (see FIGS. 4and 5). The bore 60 has a diameter that is much larger than the outerdiameter of the fiber 45 (see FIG. 7) to thereby ease threading of thesecond fiber 45 through the wall of the housing 44 after the module 42is placed within the chamber 46. For example, as shown in FIGS. 6 and 7,the module 42 can be placed at one extreme end of the chamber 46 tomaximize the distance between the bore 60 and the point at which thefiber 45 is fixed to the module 42. The fiber 45 may then be threadedthrough the bore 60. Because of the slightly extended length of the body44 and the large diameter of the bore 60, the fiber 45 can be passedthrough the bore 60 without severely bending the fiber 45 therebyreducing the likelihood of fiber breakage and, thus, increasingproduction yield. Also, because the module 42 is temporarily located ata far end of the enclosure 46, the stronger, more flexible, polymercoated section 47 of the fiber 45 is within the enclosure cavity 46 andcan, thus, be grasped to strain relieve the point at which the fiber 45is fixed to the module 42 during the flexing of the fiber 45 needed tocomplete the threading of the fiber 45 into the bore 60.

The diameter of the bore 60 is selected to matingly engage a secondoptical fiber feedthrough 64 as shown in FIGS. 4, 8 and 9. Theillustrated second feedthrough 64 is dimensioned to be attached (e.g.,soldered) to the housing 44 after the optoelectronic module 42 is placedwithin the chamber 46 after the second fiber 45 is threaded through thebore 60. As most easily seen in FIGS. 4 and 8, the second feedthrough 64has a generally cylindrical body 66 defining a channel 68 which isdimensioned to receive the optical fiber 45. The channel 68 passes fromone end of the feedthrough 64 to the other. A solder holder 70 is formednear one end of the feedthrough 64. A sealant holder 72 is formed at theopposite end of the feedthrough 64. In the illustrated example, thesolder holder 70 and the sealant holder 72 are substantially identicaland are symetrically located so that either holder 70, 72 could be usedas the solder holder or the sealant holder. Thus, the feedthrough 64does not require a particular end to be inserted into the bore 60 to beoperational. Further to this end, the ends of the illustratedfeedthrough 64 have substantially the same outer diameter which isselected to fit within the bore 60.

To provide an increased surface to solder or otherwise affix the secondfeedthrough 64 to the body 44 of the housing 40, the feedthrough 64 isprovided with a flange 74. In the illustrated example, the flange 74 hasa circular outer perimeter. The diameter of the flange 74 is greaterthan the diameter of the bore 60 (see FIG. 8). Therefore, the flange 74provides a limit on the distance that the second feedthrough 64 may beinserted into the bore 60 (see FIG. 9). As shown in FIGS. 4 and 8, theflange 74 is generally centrally located between the opposite ends ofthe cylindrical feedthrough 64. Therefore, the flange 74 limits theamount that either end of the feedthrough 64 can be inserted into thebody 44 to approximately the same distance.

After the second feedthrough 64 is threaded onto the second opticalfiber 45 and one of the ends of the feedthrough 64 is passed through thebore 60 and into the chamber 46 a distance sufficient to cause theflange 74 to abut an outer wall of the body 44 adjacent the bore 60, thesecond feedthrough 64 is fixed (e.g., soldered) to the body 44. In thisassembled state (see FIGS. 3 and 9), one end of the feedthrough 64 islocated within the chamber 46 and the other end of the feedthrough 64 ispositioned exterior to the body 44. The holder 70 or 72 at the end ofthe feedthrough 64 located within the chamber 46 may be used as thesolder holder. Thus, when a solder preform is melted in the solderholder 70, 72, a solder seal is formed within the body 44. This solderseal secures the optical fiber 45 to the feedthrough 64 and provides ahermetic seal. An epoxy seal may also be applied to the secondfeedthrough via the sealant holder 70, 72 which, as shown in FIG. 9, islocated external to the chamber 46.

After the substrate 41 of the optoelectronic module 42 is secured to theinterior of the body 44, and the fibers 43, 45 are secured to thehousing 40, a cover 78 (see FIG. 4) is secured to the top of the body 44to complete the hermetic sealing of the chamber 46.

An example method of assembling an optoelectronic package will now beexplained in connection with FIGS. 5-12. As shown in FIG. 5, a housing40 including a body 44 with a fixed feedthrough 50 and a bore 60 isfirst obtained. A thermoelectric cooler (TEC) 80 may optionally besecured within the chamber 46 of the body 44 to cool the optoelectronicmodule 42 during use.

The optoelectronic module 42 is assembled externally to the housing 40in a manner not pertinent to the invention claimed in this patent. Theoptoelectronic module 42 can be of any design, but typically includes asubstrate 41, a laser 82 (see FIG. 5), and two optical fibers 43, 45secured to opposite sides of the substrate 41 to carry light developedby the laser 82 in opposite directions.

The process of assembling the optoelectronic package is initiated byinserting an end of an optical fiber (e.g., fiber 43) of the module 42into the chamber 46. The fiber 43 is threaded through the fixedfeedthrough 50 via the chamber 46 of the body 44 (see FIG. 5). The fiber43 is advanced through the feedthrough 50 sufficiently so that thesubstrate 41 of the optoelectronic module 42 is inserted into thechamber 46. Optionally, the substrate 41with the assembledoptoelectronics (sometimes referred to as a “pill”) may be positioned toa far end of the body 44 adjacent the fixed feedthrough 50 as shown inFIG. 6. At this point, the second optical fiber 45 extends out of thetop of the chamber (see FIG. 6).

The second optical fiber 45 is then grabbed and threaded through thebore 60 defined in an end of the body 44 opposite the fixed feedthrough50 (see FIG. 7). It may not be necessary to grab the fiber 45 directlyon a metallized portion 49 because of the distance between the module 42and the bore 60 and the relatively large diameter of the bore 60. Anexample location for grabbing the fiber 45 is identified by referencenumeral 84 in FIG. 7. As shown in FIG. 7, in this example, the grablocation 84 is in a polymer coated section 47 immediately adjacent themetallization area 49 of the fiber 45.

After the fiber 45 is threaded through the bore 60, the second fiberfeedthrough 64 and the solder perform 87 is threaded onto the free endof the fiber 45 external to the body 44. The feedthrough 64 carrying theperform 87 is advanced along the length of the fiber 45 until theforward end of the feedthrough 64 is inserted into the chamber 46 viathe bore 60, and the flange 74 of the feedthrough 64 forces the solderpreform 87 (if used) against the exterior wall of the body 44 adjacentthe bore 60 (see FIG. 9). The illustrated solder perform 87 is anannular structure. In the example shown in FIG. 8, the solder preform 87has a circular circumference and a diameter greater than the diameter ofthe bore 60. Indeed, in the illustrated example, the dimensions of thepreform 87 are selected to correspond to the dimensions of the flange 74of the second fiber feedthrough 64. After the feedthrough 64 and thesolder perform 87 are positioned, the flange 74 is secured to the body44 by, for example, soldering. Because this solder operation is somewhatremoved from the optoelecronic module 42, a high temperature (e.g., 280°C. to 360° C.) solder such as Gold Tin may be used as the solder preform87.

With the feedthrough 64 secured to the body 44, the optoelectronicmodule 42 may optionally be moved to a more central location in thechamber 46 (see FIG. 10) and the metallized sections 49 of the fibers43,45 properly positioned in the feedthroughs 50, 64 for solder sealing.The module 42 is then secured to the TEC 80 by, for example, a reflowsoldering process using a hot plate and performed without flux. Becauseof the proximity to the optoelectronics, a low temperature solderingprocess should be used to secure the module to the TEC 80. For example,Bismuth Tin solder melts at approximately 138° C. and, thus, has beenfound to be a good choice for this process.

The fibers 43,45 are then sealed using the solder performs 57 as shownin FIG. 11. Because of the proximity to the optoelectronics, a lowtemperature soldering process should be used to solder the fibers 43, 45to the feedthroughs 50, 64. For example, Bismuth Tin solder melts atapproximately 138° C. and, thus, has been found to be a good choice forthis process. As shown in FIG. 11, the solder seal of the fiber 45 tothe feedthrough 64 is located inside the chamber 46 which providesenhanced hermiticity.

With the fibers 43, 45 secured to the housing 40 and sealed, a cover 78is soldered or resistance welded onto the top of the body 44. Theenclosure is now hermetically sealed. Epoxy may be inserted into thesealant holder of the feedthrough 50 and the sealant holder 70 or 72 ofthe feedthrough 64 to secure the furcation tubes (see FIG. 12).

The method of soldering described in U.S. application Ser. No.10/157,412, filed May 29, 2002 and entitled “Method Of Attaching AnOptical Fiber To A Flexure” is currently believed to be the best mode ofsoldering the feedthrough 64 to the body 44 and to soldering the fibers43, 45 to their respective feedthroughs 50, 64.

A modified excerpt from that application is attached. Interested readersare, however, referred to that application for a more detaileddiscussion of the soldering technique. In this example, the techniquewill be described in connection with securing an optical fiber to aflexure or support.

The soldering technique is a non-contact induction soldering technique.The metallized area 49 of the optical fiber is maintained in directcontact with a pre-tinned solder area of the pre-treated flexure and isready for soldering. Then, a water-cooled induction coil of anassociated induction soldering wand machine (not shown) is placed inposition over the engaged assembly of the optical fiber and the flexure.A suitable induction soldering machine is made by Seit Electronics, ofItaly, as sold under the Minimax model name, operating at 900 KHZ.

Thereafter, a short induction cycle is triggered by switching on theinduction energy source. Depending on the amount of energy utilized andthe size and design of the induction coil, a typical cycle of some 5 to9 seconds can be utilized for the induction soldering method. Theinduction soldering cycle is approximately seven and one-half (7½)seconds, with an initial four (4) seconds of a pre-gas, e.g. Nitrogen,is directed by local jets onto the solder site (to purge the area ofoxygen), then one and one-half (1½) seconds of induction coil heatingtime is applied, followed by an additional nitrogen gas flow time of two(2) seconds to ensure that the molten solder is protected from oxidationduring solidifciation.

Thereafter, the induction energy source is deactivated, and theinduction coil is removed. The soldering process is, thus, terminated.

The above technique can be applied to other solders besides the opticalfiber/module solder described above. For example, it may be applied tosoldering the feedthrough 64 to the body 44 and to soldering the fibers43, 45 to their respective feedthroughs 50, 64.

From the foregoing, persons of ordinary skill in the art will readilyappreciate that improved optoelectronic housings and methods ofassembling optoelectronic packages have been provided. The illustratedexamples reduce breakage of fibers during package assembly and, thus,result in greater productivity without changing the manner in which theoptoelectronic module 42, including the fibs 43, 45, are constructed.Moreover, the illustrated examples achieve these results while using ahousing 40 having a smaller footprint than prior art housings foropposed optical fibers.

Although certain example methods and apparatus constructed in accordancewith the teachings of the invention have been described herein, thescope of coverage of this patent is not limited thereto. On thecontrary, this patent covers all embodiments of the teachings of theinvention fairly falling within the scope of the appended claims eitherliterally or under the doctrine of equivalents.

What is claimed is:
 1. For attachment to a housing for an optoelectronicmodule, a feedthrough comprising: a cylindrical body defining a channeldimensioned to receive an optical fiber, the cylindrical body having afirst end and a second end; and a flange coupled to the body between thefirst and second ends, the flange being dimensioned to provide a surfacefor soldering the feedthrough to the housing, wherein the first endincludes a solder holder, the second end includes a sealant holder, andthe solder holder of the first end is located to be positioned interiorto the housing and the sealant holder of the second end is located to bepositioned exterior to the housing when the feedthrough is mounted tothe housing.
 2. A method of assembling an optoelectronic packagecomprising: threading a first optical fiber through a first feedthroughvia a chamber defined in a housing; inserting an optoelectronic modulecoupled to the first optical fiber into the chamber; threading a secondoptical fiber coupled to the optoelectronic module through a boredefined in the housing; threading a second feedthrough onto the secondoptical fiber; inserting an end of the second feedthrough into thechamber via the bore; and securing the second feedthrough to thehousing.
 3. A method as defined in claim 2 further comprising: securingthe first optical fiber to the first feedthrough; securing the secondoptical fiber to the second feedthrough; and sealing the housing.
 4. Amethod as defined in claim 2 further comprising: inserting a furcationtube into the second feedthrough; and fastening the furcation tube tothe second feedthrough.
 5. A method as defined in claim 2 furthercomprising threading a solder preform onto the second optical fiber. 6.A method as defined in claim 5 wherein securing the second feedthroughto the housing comprises soldering the solder preform to the housing andthe second feedthrough.
 7. method as defined in claim 2 furthercomprising soldering the optoelectronic module to a TEC located withinthe housing.
 8. A method as defined in claim 2 wherein the firstfeedthrough and the bore are located on opposite sides of the housing.9. A method of assembling an optoelectronic package comprising:threading a first optical fiber coupled to an optoelectronic modulethrough a first feedthrough from within a housing; and threading asecond optical fiber coupled to the optoelectronic module through a boredefined in the housing before a second optical fiber feedthrough isreceived in the bore.
 10. A method as defined in claim 9 furthercomprising threading the second feedthrough onto the second opticalfiber.
 11. A method as defined in claim 10 further comprising insertingthe second feedthrough into the bore.